Integrated circuit packaging
Construction and connection technology (AVT, English packaging) includes as an area of microelectronics and microsystems technology, the full range of technologies and design tools that are required in a confined space for mounting of microelectronic components ( manufactured by methods of semiconductor technology ).
AVT enables linking of micro-electronic and non-electronic micro-components to the whole system. Originally developed as a technique for making electrical contact with micro connections ( bonding ) of the microchips ( The ) and its encapsulation / Gehäusung from several disciplines ( electrical engineering, micro- joining technology, materials science ), the AVT has developed into an independent engineering discipline in the field of microsystems technology. Here, a sole procedural analysis is no longer sufficient for the increasing complexity of electronic microsystems, so that a confrontation with AVT increasingly requires a design analytical skills in the field of ECAD design.