Thin Small Outline Package

Thin small -outline packages, or TSOP is a type of chip surface mount ( SMD) of integrated circuits. A special feature of the housing shape is the low level ( about 1 mm) and low in some types of pin distance of 0.5 mm.

Molding

TSOP are rectangular plastic housing which have electrical connections (pins) only on two sides forever. There are two types: Type I has the electrical connector pins on the two shorter sides of the housing, type II on the two longer sides of the housing.