Amkor Technology

Amkor Technology, Inc. is a global electronics manufacturer, which specializes in the manufacture of chip packages and automatic test equipment for the semiconductor industry. Which is listed on the NASDAQ company is in the field packing, ie the packaging of so-called chip in this case, as the market leader.

The headquarters without significant production capacity after moving from West Chester, Pennsylvania in Chandler, Arizona. The main production facilities in China, Japan, South Korea, the Philippines, Singapore and Taiwan. Worldwide, the company employs in the year 2009 about 18,000 people and generated annual sales of approximately 1.2 billion U.S. dollars in 2004, the turnover was 1.9 billion U.S. dollars at just over 20,000 employees.

An innovation of the company was the development of the chip package Quad Flat No leads package ( QFN ) under the trade name of Micro Lead Frame ( MLF ) and the establishment of the standard JEDEC MO- 220. This chip case is due to its compact design, among others, in mobile electronic devices such as mobile phones application.

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