Anisotropic conductive film

The conductive adhesive material is an electrically conductive adhesive. A major application is the bonding of flexible conductor foils in the assembly of the liquid crystal displays.

A connection with a conductive adhesive may be less conductive than a solder joint, but is resilient and thereby mechanically resilient. This elasticity is achieved especially in the silicone adhesives used for bonding solar cells.

Conductive adhesives consist of the adhesive and inorganic, electrically conductive fillers. Their proportion is about 30%. Because of the metallic fillers used the joints are also highly thermally conductive. Among the well Suitable fillers include silver ( silver conductive ), gold, palladium, nickel, and platinum, problematic or inappropriate, however, are copper, aluminum, tin, lead, silicon, and bronze. In semiconductor technology, silver is preferably used.

A class of its own among the conductive adhesives form the anisotropic conductive adhesive. As the filler spherical conductive particles are used. The total volume is formed only 5% through the conductive material. This yields a localized electrical connection. For an order as a thin film, the electrical connection is only vertically ( between the surfaces ), but not with a horizontal design, as not to touch the balls. This allows the large-scale application of the adhesive without adjustment. A disadvantage is the limitation of the operating temperature to 80 degrees Celsius and a principle implied conditional short circuit probability.