Chip Scale Package

Chip Scale Package (CSP, English, . Too German housing in the magnitude of the ) is a chip package of integrated circuits, in which the surface of the at least 80 % of the area of the housing makes up what can be seen, the connections for SMD assembly without bonding with the need to be connected.

In order to achieve the low casing base, either the flip -chip assembly ( of the reversed down after metallization its external contacts on the board ) or used the WLCSP method. The WLCSP method for the protection of the bottom of a protective lacquer and top a plastic housing is applied.

The CSP therefore represents a further development of the Ball Grid Array (BGA ), which goes back to ideas from employees of Fujitsu and Hitachi Cable and was first built by Mitsubishi Electric.

A reduction of the case is useful for example in medical, for example, for swallowable diagnostic equipment, and in the high-frequency technology for short transmission paths.