Dual in-line package
The English term dual in - line package ( DIP acronym, and dual in-line, short- DIL, dt » double row housing " ) is an elongated housing form (English Package) for electronic components, in which two rows of pins (pins ) are for through-hole mounting on opposite sides of the housing.
Function and application
The connecting pins are designed to be inserted through holes of a circuit board and soldered on the lower side. For single-layer printed circuit boards and multi-layer with plated-through printed circuit boards, it is thus possible, in contrast to the above lying surface-mounted enclosures to solder the components by wave soldering.
Components in DIP packages can also be used with jacks to replace they can. DIP is the classic case design for integrated circuits. There are also other devices in DIP packages, for example, relays, small switches ( DIP switches) or resistor networks. The housing usually have between 6 and 48 pins and a body made of plastic or ceramic. The ceramic version is also known as CERDIP ( in contrast, for PDIP plastic potting ).
For optocoupler often four or six-legged housing are used.
In contrast to the DIP package has a single in - line package ( SIP / SIL, ie single-row housing) only one row of pins for through-hole mounting. Both DIP as well as SIP, there are configurations in which the pins offset in the row are arranged mutually in a zigzag manner, thus alternately at a pitch further to the outside or inside, thereby, the pads or the spacing dimension greater. Such SIP designs are also called ZIP.
Due to the increasing miniaturization and the increasing number of required connections for integrated circuits, the use of the DIP housing since the 1990s has declined drastically. However DIP packages are in the prototype stage useful because they can be used in contrast to SMD components well by hand on breadboards (printed circuit boards with solder eyes or perforated grid to experimental purposes).
Typical dimensions
Most DIPs have a pin grid of 2.54 mm and a row spacing of 7.62 or 15.24 mm. Due to the double-row arrangement of the pins all types have an even number of pins. The 7.62 - mm version usually has 8 to 24 pins (sometimes 28). The 15.24 - mm version is equipped with 24, 28, 32, or 40 pins (sometimes also 36, 48, 52 or 64).
The JEDEC standard also less common variants before 10.16 or 22.86 mm row spacing. These variants may have up to 64 pins. Other standardized versions have a pin spacing of 1.778 mm.
Rarely, there are also components with a pin grid of 2 mm and a row spacing of 5.35 mm.
Pin assignment
By default, the chips in one sketch in a view from above ( " component side ") that specifically shown in the picture with the 7400 in the transverse direction, so you can read the imprint directly. The notch in a narrow housing side is always the left. Left bottom of this notch, the count of the pins from 1 starts and then proceeds counterclockwise around the chip to the left upward. Pin 1 is also usually characterized by a printed or embossed mark.
The assignment of the power supply follows in digital circuits usually the standard that the mass at the bottom right and the positive operating voltage can be connected directly on the top left next to the notch. Because of this standardization, it is also worthwhile to offer Jacks for these ICs with already built- up capacitors.
DIL or SMD versus SO
When established, the components for surface mounting (English surface mounted device SMD), the demand for surface-mounted integrated circuits ( SMD IC) rose sharply. In order to meet the demand and to sell to the already produced DIP circuits, manufacturers began, DIPs to fashion in SMDs by perpendicular bow pins beneath the component body bottom edge outward. A SMD - version with DIL dimensions emerged, but this was the late 1980s, hardly used. Were parallel to Plastic Leaded Chip Carrier ( PLCC ), where the pins were bent under the housing inwardly. As a special PLCC SMD are one of the few housing options for which versions are available as standard.
Later conversion to SMT consistently led to miniaturization and the smaller SMD pitches of 1.27 mm or 0.65 mm, the now outward again bent connecting legs in the SO- types (such as SOP of Engl. Small outline package or TSSOP of engl. thin shrink small outline package). The new assembly technology required new manufacturing and assembly machines, but saves space and housing material, requires less precise meeting of the solder pads with the assembly ( the holes for DIL devices were often drilled conically in the single-layer printed circuit boards, to meet them with the pins work safe).
The above standards for pin assignment were taken over unchanged in the smaller scale in the SMD variants.
2004, there were still many older and standard ICs in DIP packages available. Individual ICs were available even just in DIL packages so that you can find on the boards often mixed assembly (SMT and through-hole assembly).
In many newly developed components, the SMD types are offered frequently only. This is especially true for components that will be working with high frequency ( such as processors ). Due to the larger dimensions of the DIL package, and the associated line length, these devices can not be operated at very high frequencies, when high-speed data lines, such as buses, to be led out. Despite the dominance of the SMD components, new microcontroller in DIL package itself came in 2013, still on the market.
DIL circuits are better suited for the construction of prototypes, test circuits or small series, since they can be easily soldered by hand. DIL designs of the same chips despite higher material requirements today hardly more expensive, sometimes even cheaper than SMD. One reason is perhaps the fact that DIL components during soldering must withstand temperature lower loads than SMD.