EV Group

EV Group (EVG - originally "Electronic Visions Group" ) is a manufacturer of processing equipment for the semiconductor industry, microsystem technology and nanotechnology. Its products include manual and fully automated photolithography systems, wafer bonders and inspection systems that can be used both for research and development as well as for industrial mass production. The product and process development as well as the entire production is centralized at the company's headquarters in St. Florian am Inn ( Austria ). ECG has offices in the USA, Japan, Korea and Taiwan. Overall, the company employs approximately 700 employees.

History

The company was founded in 1980 by Erich Thallner, now president of the company, and Aya Maria Thallner under the name Electronic Visions Co. as an engineering partner for the semiconductor industry. Subsequently, the corporate headquarters was expanded in several steps. Parallel to the expansion of the Group's headquarters was opening up international markets through the establishment of subsidiaries in Europe, USA and Asia triad markets. 2011 there was an expansion of manufacturing capacity by increasing the production area was more than doubled by adding an extension. Furthermore, the clean rooms and applications laboratories were extended to four times the size. ECG won the 2012 economic price of Pegasus OÖNachrichten in Gold in the category of Leading Companies. In the same year TOE was also awarded the prize for regionality of the district Rundschau. The end of 2012, the company announced that it is expanding a company kindergarten and a new staff restaurant.

To technology and product development of electronic ballasts heard of in 1985, developed the world's first double-sided mask aligner with bottom side microscopes, which provided a contribution to the commercialization of MEMS products (MEMS = Micro-Electro - Mechanical Systems ). In 1990, a separation process in wafer alignment - that is, the orientation of the wafer - and the actual wafer bonding, with several silicon wafers (wafer ) and the constructed thereon electronic circuits are connected to a functional unit. The introduction of the first automated wafer bonding system for the mass production of MEMS in 1992 laid the foundation for the activities in the market for wafer bonders.

In 1994, installed the first ECG SOI production Bonder (SOI = Silicon on Insulator) for the mass production of multi-layered silicon -insulator- silicon wafer as a base for high-end microprocessors and received the 2004 Austrian State Prize for Innovation. Developed in 1999, patented SmartView system for wafer alignment direction for 3D applications.

In 2001, EVG developed the first systems for temporary bonding and debonding as a key technology for 3D integration of wafers with through-silicon -via technology. The world's first fully automated wafer bonding system for 300mm wafers, which paved the way for the commercialization of 3D integration, was presented in 2002.

ECGs presented in 2009 UV-NIL ( nanoimprint lithography ) of the latest generation and the first fully automated fusion bonding system with optical wafer alignment systems allowed the industry to develop new ways in the production of wafer - level cameras to go.

2010 brought EV Group, the first fully automated wafer bonding system for the production of HB- LEDs on the market, which will be chosen by the Austrian magazine "Factory" Innovation of the Year for 2010. In 2011, EVG developed the industry's first wafer bonding system for wafer sizes of 450 mm. Furthermore, the new XT Frame system platforms are brought to the market with higher throughput and automation, on the basis of 2012 new systems for temporary wafer bonding and debonding - were presented for the large-scale production. Also in 2012 presented ECG before a new modular generation of automatic plants for spin or spray coating and development of photoresists for lithographic processes in semiconductor and MEMS production.

Memberships in industry organizations and technology consortia

  • NILCom
  • EMC3D
  • IVAM Microtechnology
  • MANCEF
  • MEMS Industry Group
  • Austrian Society for Micro System Technology
  • Optical Society of America
  • Semiconductor Equipment and Materials International
Microelectromechanical systems Wafer (electronics)
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