Integrated circuit packaging

Construction and connection technology (AVT, English packaging) includes as an area of ​​microelectronics and microsystems technology, the full range of technologies and design tools that are required in a confined space for mounting of microelectronic components ( manufactured by methods of semiconductor technology ).

AVT enables linking of micro-electronic and non-electronic micro-components to the whole system. Originally developed as a technique for making electrical contact with micro connections ( bonding ) of the microchips ( The ) and its encapsulation / Gehäusung from several disciplines ( electrical engineering, micro- joining technology, materials science ), the AVT has developed into an independent engineering discipline in the field of microsystems technology. Here, a sole procedural analysis is no longer sufficient for the increasing complexity of electronic microsystems, so that a confrontation with AVT increasingly requires a design analytical skills in the field of ECAD design.