Land Grid Array

A land grid array ( LGA) is a connection system for integrated circuits (IC, integrated circuit).

The LGA system, the terminals of the integrated circuit will be at its bottom in the form of a chessboard-like array ( grid array) of contact areas (country ) is performed. It is closely related to the PGA system (pin grid array), which takes the contact surfaces, the well-known " legs" ( pins) owns, and the BGA system ( ball grid array), which uses solder balls.

LGA processors are usually placed on a base, comprising resilient contacts which has a lower mechanical stress on the contact result. Other LGA ICs but often also as PGA ICs soldered directly. BGA ICs, however, are solely intended for soldering, they bring the necessary solder in the form of solder balls with the same. All three versions are intended primarily for ICs with hundreds to over a thousand connections.

The land grid array is suitable in contrast to the Pin Grid Array for higher frequencies and cheaper to produce.

For x86 processors, the land grid array was introduced in June 2004 by Intel as Socket 775 ( LGA775 also ) for the Pentium 4 series with Prescott core and from 2006 was also the competitor AMD for its intended for servers and workstations Socket F introduced. More CPU socket, which are built in LGA housing, are also intended for server socket 771 and socket 1155, socket 1156, socket 1366 and socket 2011 Intel. By Sun Microsystems, the LGA technique was, however, since the mid- 1990s, for example, used in the UltraSPARC processors.

Socket F

Related designs

  • Ball Grid Array
  • Ceramic Column Grid Array
  • Pin Grid Array
  • Processor Socket
  • Housing
LGA 771 LGA 1156 LGA 1366
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