Pin grid array#Flip chip

Flip Chip Pin Grid Array (FC- PGA FCPGA ) is a form of pin grid array in which the integrated circuit (IC ) is attached to the carrier on the top ( inverted, inverted chip ' English flip chip ).

Originally, the ICs are often mounted on the side facing the circuit board of the PGA or wired, with increasing speed and increasing power dissipation of the processor but one went over to mount the actual processor core on the upper surface of the support and wired. Protected by a heatspreader, the waste heat could be sold direct to the on heatsinks.

With the introduction of the Pentium III or some Celeron models for Socket 370 Intel called this regardless of the carrier material mainly as FCPGA processors in these models, the heat spreader was removed to allow a more direct heat transfer to the heat sink. With the Pentium III and Celeron processors with Tualatin core again a heatspreader has been added. Later followed μFCPGA (Socket 478).

In everyday language, the terms FC -PGA processor and socket 370 processor has therefore become interchangeable and meaning are not always correct in the technical use.