Power electronic substrate

Direct bonded copper ( DBC also Engl. Direct bonded copper, DCB), in the construction and connection technology is a structure which enables a strong electrical / thermal connection to copper. This is important for an optimal heat dissipation.

The DBC substrate is technically produced at low cost.

On the DBC substrate slightly large, metallic interconnects structures can be created.

Other substrate materials

Another substrate is IMS substrate (insulated metal substrate), in which the lower layer of aluminum instead of copper ( see picture).

For bendable sinkers and Kapton flexible substrates may be used

In the automotive industry are used ceramic substrates because of their high quality in general. Because of high development costs, however, these are not suitable for prototypes.