Quad Flat Package

Quad Flat Package ( QFP ) referred to in electronics a widespread housing design for Integrated Circuits. The connections (pins ) are located on the four sides of the flat housing. QFP be soldered as surface mounted components on printed circuit boards.

QFP generally have 32 to 200 pins, which in a height (pitch) are spaced from 0.4 to 1 mm. Less connection pins is rather the small outline package (SOP or SOIC ) are used in which the pins are arranged on two opposite edges. For larger pin counts often finds the Ball Grid Array (BGA ) application, in which the whole underside serves as a connection area.

A direct predecessor of the QFP Plastic Leaded Chip Carrier was the ( PLCC ), the (50 mil) and a significant larger cabinet height uses a larger pin spacing of 1.27 mm.

Variants

Starting from the basic form, a flat rectangular (often square ) body with pins on all four sides, a variety of designs will be used. These usually differ only in pin count, pitch, dimensions and materials used ( usually to improve the thermal properties ). A significantly modified version is the bumpered Quad Flat Package ( engl. = bumper bumper), wherein protrusion "noses" at the four corners pins are protected against mechanical damage, before the component is soldered.

The relevant details are vendor-specific.

  • BQFP: bumpered Quad Flat Package
  • BQFPH: bumpered Quad Flat Package with Heat spreader
  • CQFP: Ceramic Quad Flat Package
  • FQFP: Fine Pitch Quad Flat Package
  • HQFP: Heat sinked QFP
  • LQFP: Low Profile Quad Flat Package
  • MQFP: Metric Quad Flat Package
  • PQFP: Plastic Quad Flat Package
  • SQFP: Small Quad Flat Package
  • TQFP: Thin Quad Flat Package
  • VQFP: Very small Quad Flat Package
  • VTQFP: Very Thin Quad Flat Package
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