Thermal adhesive

Thermal adhesive is two-component adhesives, usually epoxy or silicone, which are used for example for mounting heatsinks. The thermal conductivity is thereby produced on ceramic or metallic fillers (Al2O3, AlN). Compared with thermal compound, the thermal conductivity is generally lower. Add to that the most required larger layer thickness. For " non-destructive " disassembly of bonded components (radiator, components ... ) but usually the adhesive bond must be weakened before ( eg by heating above the glass softening TG).

For selecting the right adhesive several aspects must be considered. Although an increased filler content improves thermal conductivity, however, deteriorates the strength of the adhesive bond. Too high a proportion of adhesive under thermal stress can lead to significant differences in expansion (CTE mismatch) and loosen the adhesive bond, since organic substances compared to inorganic materials have a very high coefficient of expansion. Wärmeleitklebstoffe on epoxy resin exhibit by the denser cross-linking to a better thermal conductivity than silicones. Must be compensated through the adhesive additionally mechanical stresses, such as is advantageous in the usual bonding technique the material class of silicones.

• Adhesive