TSMC

The Taiwan Semiconductor Manufacturing Company Limited ( TSMC ) (Chinese台湾 积 体 电路 制造 股份有限公司, short chinese台 积 公司, Pinyin Taiji Gongzi ) after Intel and Samsung, the world's third largest semiconductor manufacturer and the world's largest independent foundry ( contract manufacturer for semiconductor products ). TSMC was founded in 1987. The divisional headquarters and main parts of the company are located in Hsinchu, Taiwan.

The business model of TSMC is designed to take over the production of semiconductor chips (ICs ) for fabless companies such as NVIDIA, AMD, Qualcomm, Conexant, Marvell, Broadcom, or VIA. The company is extremely profitable and made ​​continuously since 2004 margins of> 30 % after taxes.

Data

The Company's shares are traded on the Taiwan Stock Exchange and on the New York Stock Exchange under the symbol TSM. The chairman of the company is Morris Chang, who also was CEO until 2005. From 2005 to 2009 Rick Tsai was the CEO, since it is again Morris Chang, who thus current chairman and CEO of the company.

  • Turnover: approximately $ 14.1 billion (2011)
  • Profit: USD 4.4 billion (2011)
  • Margin after tax: 31.5%

On 18 June 2013, the market capitalization was EUR 71.052 billion.

Works

  • A 6-inch wafer plant in operation (Fab 2)
  • Five 8-inch wafer fabs in operation ( Fabs 3, 5, 6, 7, 8)
  • Two 12 -inch wafer fabs in operation ( Fabs 12, 14)
  • TSMC Shanghai
  • WaferTech, a 100% owned to TSMC 8-inch wafer fab in Camas, Washington, USA

In 1998, TSMC began with Philips Semiconductors (now NXP Semiconductors) and EDB Investments of Singapore, the joint venture Systems on Silicon Manufacturing Cooperation ( SSMC ) to build a semiconductor plant in Singapore. TSMC increased in November 2006 its shares in SSMC to 38.8 %.

Technology

State of the art since 2008 the production of chips with a feature size of 40 nanometers ( in the 40 -nm process ) by the 193- nm immersion lithography, strained silicon and the low-k dielectric - semiconductor technology. The first products in the 40 -nm process have included Altera hardcopy ASIC, the RV 740 GPU from AMD and the 40 -nm Stratix IV FPGA device family.

In the 3rd quarter of 2010, we started the production risk in 28nm process, the mass production should start in Q4 2010.

Types of business entity International Securities Identification Number Foundry model Fabless manufacturing Chief Executive Officer Wafer (electronics) Washington (state)
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