Die (integrated circuit)

The A ( [ daɪ ], english for, cubes, flakes ', plural: this or dice [ daɪs ] ) is in the semiconductor technology, the designation of a single unpackaged semiconductor chips. Such or the " bare chip " is usually obtained by sawing or breaking of the finished wafer into rectangular parts ( dicing ) on which each a complete, working component is located.

Etymology

The term " the " stems from the kitchen English: "slice and dice " means - as a cucumber - " first cut into slices and then dice ." Accordingly, in the manufacture of integrated circuits starting with a - cucumber-like - silicon ingots, this is then " sliced ​​" - it makes the " wafer" = " waffles " - and then "chopped " - it then makes the " dice" = "cube". Since the wafers are very thin, however, see the " dice" is not a cube, but rather correspond in shape to very flat blocks.

"Bare Chip"

With "Bare Chip" or " bare die " ( German " bare chip " ) are integrated electronic components referred to, which are not commonly installed in a plastic or ceramic case, but further processed without housing. They are applied directly to a printed circuit board or a ceramic substrate and connected by wire bonding electrically with surrounding components.

Application

As part of the ongoing integration are becoming more assemblies that were previously installed as individual chips next to each other on a board, united on a common chip. Now be placed on a die of about a square inch area, several hundred millions of transistors for CPUs, GPUs and RAM.

Digital and analog signal circuitry may increasingly be accommodated with power-electronic elements on a single chip (for example, BiCMOS technology).

A combination of two complementary modules, such as CPU and cache on a chip can be with the term "on- The " rewrite: The CPU has the cache "on- the ," ie directly on the same chip, allowing for higher clock rates and bus widths and thus allows the exchange of data much faster.

Processing

With the further processing of this - Gehäusung and integration into the circuitry surrounding area - is concerned the construction and connection technology (AVT, English packaging. ).

As Known Good Die ( KGD) is a term given according to the specifications and tested as well befundenes semiconductor wafer, which may contain as a microprocessor depending on the product is a single component, for example a transistor, or a complex circuit. Good or defective, this can this be determined even in the wafer composite by electric needle tester. Faulty components were previously identified by a colored dot ( inked ) and the subsequent process of contacting and Einhausens ( cycle II, Eng. Packaging ) are excluded.

The ratio of useful to the total number of all existing on a wafer dice is called the yield ( engl. yield ) and is an important indicator for assessing the manufacturing process and the efficiency of a production line.