Tape-Automated Bonding

Tape Automated Bonding (TAB ) is a bonding method for raw semiconductor chip ( integrated circuit) and enables the rapid assembly usually directly on the printed circuit board ( chip -on-board ). As a carrier serves a Polyimidefilm with bonded copper lines for the connections. The method allows a very fine- textured pitch and is thus particularly suitable for chips with high port number.

Originally, the TAB was developed as a low cost alternative to wire bonding. Today TAB is widely used for connecting the display driver with the LCD itself