Hybrid integrated circuit

The thick-film hybrid technology is a construction and connection technology for manufacturing electronic circuits ( thick-film hybrid circuit ) in which both integrated and discrete components can be used.

Method

As support material usually plates made ​​of alumina ceramic substrate, and ceramic films for LTCC technology used ( LTCC Low Temperature Co-fired Ceramics english ). Interconnects are printing technology applied by screen printing and may be - by insulating layers - even cross. Likewise, electrical resistors are made ​​which, if necessary, subjected subsequently by the laser trimming a laser fine tuning. More rarely, capacitors are printed - but there are only small values ​​(<1 nF ) to produce.

The thus printed carrier is fired, the applied frits ( powder mixtures for resistance, insulation or conductors ) merge to form highly resistant and reliable layers.

This thick film circuit can then be with other non- printing technology manufacturable components ( active components, capacitors ) further equipped. The use of bare semiconductor chips, so bare silicon This, offers itself due to the good thermal conductivity of the substrate. The most commonly used techniques for the compound attached to the thick film circuit elements are reflow soldering and bonding.

Benefits

  • Use of components of different manufacturing techniques possible
  • Substrate is a good, low-loss isolator
  • Power loss is dissipated well over the substrate ( approximately the same temperature over the whole circuit of time )
  • Pressure technically feasible resistors highest accuracy ( laser trimming, better than 0.1 %) in wide ranges of values ​​(milli - up megohms )

Areas of application

That thick-film circuits would be economically producible only at higher volumes, is a no longer tenable in today's time assertion, but should - depending on the application and purpose - are always checked if a conventional solution in SMD technology on PCB technical difficulties brings.

Especially in terms of miniaturization factors ( area available for the electronics ), thermal conductivity, higher operating and ambient temperatures and other extreme environmental conditions ( eg vacuum) are the technical benefits of a hybrid circuit undisputed.

Thick-film circuits are used wherever high reliability is required and / or adverse environmental conditions ( humidity, vibration exposure ) prevail:

  • Automotive electronics ( motor control, ABS, ... )
  • Industrial Electronics and Power Electronics
  • Measurement and control technology
  • Military technology, aerospace
  • Telecommunications
  • High-performance computer systems
  • High-frequency components ( eg antenna amplifier and small transmitter)
Integrated circuit packaging Manufacturing engineering
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