System-in-Package

System-in- Package (SiP ) is an approach to integration in microelectronics, technically between the monolithic on-chip integration ( system-on -a-Chip, SoC) on a die ( ungehauster semiconductor chip ) and the On- board integration of discrete components is located on a printed circuit board (PCB, multi-chip module). This passive and active devices, and other components are produced by microsystem technologies on plural semiconductor chips and these combined in one housing ( called IC Package) by means of the construction and connection technology. In contrast to multi-chip modules (ie two-dimensional) are planar structure and are therefore among the electronic printed circuit boards, can be in a SiP and vertical integration of components realize (3D, 2.5D SiP). The electrical connections between the individual, this will be either by bonding wires, as thin conductive side edges of this or as a plated-through hole running of this world.

SoC and SiP are the two main production methods for complex integrated semiconductor devices dar. When SiP This can be used, based on different materials or made ​​with process structures. In addition, discrete peripheral components can be integrated with the housing in a SiP. When SiP manufacturing (packaging) is more expensive than in the SoC, while a complete integration of all functionalities on one chip is usually more expensive. Which one is better depends very much on the functionality of the circuit.

There are designing SiP design software from the major EDA vendors. In the SiP it is economically sensible means of Known- Good -Die- tests to check the accuracy of the chips before the integration.

Related approaches

  • Flip -chip mounting
  • Construction and connection technology of the electronics
Integrated circuit packaging Through-silicon via Flip chip
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