Quad Flat No Leads Package

Referred Quad Flat No leads package ( QFN ), also known as Micro Lead Frame ( MLF ) is a conventional in the electronic chip housing design for integrated circuits (IC). The term includes various sizes of integrated circuit packages which are soldered all as surface mounted components to printed circuit boards.

As an essential feature, and in contrast to the similar Quad Flat Package ( QFP ) extend the electrical connections ( pin) does not project laterally beyond the dimensions of the plastic coating also, but are not in the form of tin-plated copper terminals in the flat bottom of the housing integrated. As a result, the required space on the PCB will be reduced and a higher packing density can be achieved.

General

Were developed QFN chip package of the company Amkor Technology which markets it under the trade names of Micro Lead Frame ( MLF ) and Micro Lead Package ( MLP). Individual QFN and their sizes are specified under the standard JEDEC MO -220.

The pins are usually located on the four sides of the flat housing, with some versions, only on two sides. Some designs have one or more metal surfaces in the interior, which is used to derive the heat loss. QFN generally have from 8 to about 200 pins arranged in a grid pattern (pitch) are arranged from 0.4 mm to 1 mm. The housing heights are different depending on the type and are usually in the range of 1 mm, the thin most designs have Housing thicknesses of 0.4 mm and are also known as QFN (Very Thin QFN ).

The small form of parasitic inductances are reduced at the terminals, which mobile is beneficial especially in high-frequency applications, such as in the field.

Variants

The housings are different and usually vendor-specific names in the trade. Typical names are:

  • MLPQ (Micro Lead Frame Package Quad)
  • MLPM (Micro Lead Frame Package Micro)
  • MLPD (Micro Lead Frame Package Dual )
  • DRMLF (Dual Row Micro Lead Frame Package)
  • DFN (Dual Flat No -lead Package)
  • TDFN (Thin Dual Flat No -lead Package)
  • UTDFN (Ultra Thin Dual Flat No -lead Package)
  • QFN ( Quad Flat No -lead Package)
  • QFN - TEP ( quad flat no -lead package with exposed pad top )
  • TSSOP (Thin Quad Flat No -lead Package)
  • QFN (Very Thin Quad Flat No Leads Package)
  • DHVQFN ( dual in-line compatible thermal enhanced very thin quad flat package with no leads (NXP ) )

Links, sources

  • Quad Flat Pack No- Lead ( QFN ) (PDF, 4.7 MB), Application Note Freescale Semiconductor, September 2008 - ( AN1902 ) (English )
  • Housing
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