Intel Core#Nehalem microarchitecture based

  • LGA 1156 ( H1)
  • LGA 1155 (H2)
  • LGA 1150 (H3)
  • 1366
  • LGA 2011
  • PGA 988A (G1 )
  • PGA 988B (G2 )
  • BGA 1023
  • BGA 1224
  • BGA 1288
  • Bloomfield
  • Lynnfield
  • Clark Field
  • Clarkdale
  • Arrandale
  • Gulftown
  • Sandy Bridge
  • Ivy Bridge
  • Haswell

The Core i series is a family of x86 microprocessors with Intel 64- Vendor extension Intel, which will replace the Core 2 family since late 2008. The processors are based on the Nehalem, since the year 2011, on the Sandy Bridge, since 2012 on Ivy Bridge and since 2013 on the Haswell microarchitecture.

  • 2.1 Bloomfield 2.1.1 Chipset for bloomfield based processors
  • 2.1.2 Error Directory of bloomfield based processors
  • 3.1 Clarkdale
  • 3.2 Arrandale
  • 3.3 Gulftown
  • 4.1 Sandy Bridge
  • 4.2 chipset for Sandy Bridge processors
  • 4.3 Sandy Bridge E
  • 5.1 chipset for Ivy Bridge processors
  • 6.1 chipset for Haswell processors
  • 7.1 desktop 7.1.1 Clarkdale
  • 7.1.2 Lynnfield
  • 7.1.3 Bloomfield
  • 7.1.4 Gulftown
  • 7.1.5 Sandy Bridge Duo
  • 7.1.6 Sandy Bridge
  • 7.1.7 Sandy Bridge E
  • 7.1.8 Sandy Bridge E ( Quad)
  • 7.1.9 Ivy Bridge
  • 7.1.10 Ivy Bridge Duo
  • 7.1.11 Haswell
  • 7.2.1 Clark Field
  • 7.2.2 Arrandale
  • 7.2.3 Sandy Bridge
  • 7.2.4 Sandy Bridge Duo
  • 7.2.5 Ivy Bridge
  • 7.2.6 Ivy Bridge Duo

Naming and classification market

After the previous Intel Core 2 Intel versa when brand name back to Intel Core.

I3, i5 or i7

This Intel divided with the appendage i7, i5 and i3 processors in certain classes. Which appendage gets a processor does not depend on the used base, but from the processor features from: The number of cores, Hyper- Threading ( SMT), width of the memory interface and the turbo mode play an important role, but other features such as Trusted Execution Technology ( TXT) as well as parts of the cache can be disabled with smaller model number appendages.

Processor Series Core i7 is initially intended for the performance and high-end segment, which is why there is also an Intel Extreme Edition with free multiplier in the tradition of previous series. Core i5 is positioned directly under the Core i7. In early 2010 was followed by new dual-cores (i3 and i5 partially ) in 32- nm production with which the older Core 2 Duos were replaced.

Despite this broad division can not say that Core i7 CPUs are generally faster than Core i5 CPUs or that Core i5 CPUs are generally faster than Core i3 CPUs, as this part of the name not only to you performance, but also of features oriented. In addition, all processors are updated at the time, so newer processors with smaller i- number can be considerably faster than even older with a higher i- number.

3 - or 4- digit model number

On the i- number is followed by a 3 - or 4- digit model number. This depends on different features. The Thermal Design Power (TDP ) is an important criterion for the choice of the model number, so that a slower CPU with a lower clock and otherwise same features can have a higher model number than faster with higher TDP.

After the digit "i- number " for the processor class is followed by a three digit number with the first generation of Core i processors.

In the published in 2011 processors based on the new Sandy Bridge microarchitecture still a "2" before the three -digit model number is set so that overall a four digit number. Exceptions are the models Intel Core i7- 38xx and i7- 39xx, which were presented at the end of 2011 from Intel for LGA 2011, but on the Sandy Bridge -E microarchitecture still based with a "3" to begin.

In the first half of 2012, Intel released processors with optimized Sandy Bridge microarchitecture named Ivy Bridge in a new 22nm manufacturing before, these represent the third generation of Intel Core i processors dar.

In the late summer of 2013 Intel introduced the fourth generation of Intel Core i processors, whose model number starts with a " 4", eg Intel Core i7 4770th

Letters appendage

Located directly on the model number may be one or two capital letters Attached.

  • E - An "E " may be used alone or in combination ( "TE ", " UE ", " ME ", " LE ", " QE " or " EQ" ) be attached and always stands for embedded
  • X - An "X" or in combination ( " XM " or " MX ") stands for extreme, ie processors with upwardly open multiplier. (only with i7 available)

In the desktop segment:

  • K - attached processors with a "K " in the model number have an upwardly open clock multiplier. (only on i5 and i7 available)
  • S or T - Here is desktop CPUs with lowered ("S", low power) or strongly bowed ("T", ultra low power) Thermal Design Power (TDP )

In the notebook segment:

  • LM or UM - Here is mobile CPUs with lowered ( "LM", low power) or strongly bowed ( "UM ", ultra low power) Thermal Design Power (TDP ). From the Core i - 2000M - series drop the initials " LM" and "UM " but away again, so that you can bring about the TDP in experience only about studying the data sheet.
  • U or Y - From the Core i 3000 series are laptop processors with reduced voltage and a TDP of less than 17-18 watts with the letter " U" ( ​​low power) and less than 13 watts with "Y" ( ultra low power) in.
  • QM - For mobile quad cores is a "QM " for " quad core mobile " appended.
  • M - If the mobile dual-cores is just added on an "M" for " Mobile ".

Cores of Nehalem generation

Bloomfield

As the first Intel processor for the desktop market in the Bloomfield has the memory controller integrated directly onto the chip, as practiced since the AMD processors based on the K8 architecture. The processor has three memory channels, can be used in parallel by the similar to the usual dual-channel mode three identical memory modules; However, it is also possible to use only two of the channels. As memory type DDR3 RAM only comes with officially up to 133 MHz clock (DDR3 -1066 ) for use; An alternative use of DDR2 RAM is no longer possible. The communication to the Northbridge is done by the so-called QuickPath Interconnect ( QPI ), which / s in each direction represents a very broadband point-to -point connection depending on the model with 9.6 to 12.8 GB, similar to that used by AMD HyperTransport. QPI replaces the in its basic form originating from ancient times to the x86 family frontside bus from. All processors with the Bloomfield core feature called Turbo Boost technology: In the case of the utilization of a single core of the multiplier of this core is increased by two index points, while other cores are clocked down, are in the case of the utilization of two to four cores their multipliers increased by up to a counter point, provided that the utilization of the cores does not demand the maximum TDP of the processor without these clock increase.

Chipset for bloomfield based processors

Due to the performance classification, Intel chipset than just an expensive version is available, the "Intel X58 " was baptized. Developed under the code name Tyler Castle chipset - as opposed to later, more favorable series processor based on the Nehalem architecture - still a classic design from North - and Southbridge.

Chipsets from other manufacturers is not available for Bloomfield processors. Nvidia had announced in a press release that the SLI capability for platforms with the Core i7 processors is realized via an additional chip to the X58. In the end, Intel and Nvidia could agree, however, that Nvidia offers similar to ATI a license for integrating the multi-GPU technology in the X58 chipsets.

Error directory of bloomfield based processors

Intel describes in his Specification Update November 12, 2008 for the Core i7 an erratum regarding the translation lookaside buffer, which occurred in previous processor series from Intel and AMD. Even before the launch but the motherboard manufacturer Intel were asked to work around the error by a BIOS update. Intel assumes that the manufacturer of this call are also fulfilled.

Lynnfield

Lynnfield is manufactured in 45 nm feature size quad-core processor that can perform using Simultaneous Multithreading (disabled on some models) up to eight threads simultaneously. Bloomfield as when the memory controller is located on the processor die. In contrast to this, the memory controller of Lynnfield speaks to the DDR3 memory in dual -channel method. Also from Bloomfield series comes integrated Turbo Boost Technology, the clock frequencies of the different increases depending on the workload of the individual cores, without exceeding the TDP; However, the maximum clock increase precipitates more than is the case with the Bloomfield. In the case of utilization of a single core, the multiplier of this core to five index points in the case of utilization of two cores is increased by 4 counter points while inactive clocked down cores, in the case of the utilization of three or four cores which multipliers are for a maximum of one meter point increased, provided that utilization of the cores does not demand the maximum TDP of the processor without these clock increase. Further features of Lynnfield on the power saving function EIST, clock speed and operating voltage of the processor when not in utilization lowers. In contrast to Bloomfield not only the memory controller, but the entire Northbridge, including PCI Express controller integrated into the processor, the communication takes place there still ( but now within the processor ) via the QuickPath Interconnect. The motherboard is accordingly only a Southbridge installed, which is connected usually with Direct Media Interface (DMI ) as at Intel. All Lynnfield CPUs can be used with chipsets of Intel 5 series. However, since the processor uses the pedestal 1156, it can not be operated on the imaginary for the Bloomfield X58 motherboards.

At the completion of the dual-core Intel Havendale offshoot renounced early in favor of Clarkdale.

Clark Field

Clark Field is identical to the core Lynnfield design. The CPU die but packed into a chip housing for Socket 988. In addition, all processors are sold with a low TDP, as they are designed for the mobile market segment. The maximum stroke of a core in turbo mode falls relative to the standard clock again from greater than on Lynnfield - based is the case with the desktop models. Ultimately, however, depends on the utilization of this clock margin critically on the cooling off because the Turbo Boost technology oriented well as the temperature.

Processor cores of the Westmere generation

Clarkdale

The CPU cores in the Clarkdale are technically largely similar to those from Lynnfield, but are manufactured in 32 nm process. Unlike the Lynnfield of Clarkdale has only two cores and the memory controller is not connected directly with the nuclei, but located on the same die with the GPU core and is connected via the QPI, which in compared to Lynnfield at significantly higher latencies memory accesses by the processor operates. The semiconductor chip with the GPU core and the memory controller is manufactured in 45nm process and housed in all Clarkdale processors in the same chip package as the CPU. Because of the reduction of feature size assigns the Intel Clarkdale processors of a new generation of processors, codenamed " Westmere " to. As part of the Westmere architecture of Clarkdale has seven new instructions (on some models disabled), with six dedicated to the topic of AES encryption.

How Lynnfield the Clarkdale processors are operated in the 1156 base and can be used on chipsets of Intel 5 series. However, the integrated graphics can not be used on motherboards with the P55 chipset, but only with the newer chipsets ( H55, H57, Q57 ). The image signals from the integrated GPU will be transmitted via the " Flexible Display Interface " (FDI ) to the chipset, where FDI is based on the DisplayPort standard.

Arrandale

Arrandale corresponds technically to the Clarkdale, but is optimized for use in notebooks. Therefore, it is intended for use in sockets and PGA988 BGA1288 and has a lowered TDP, which is partly achieved with reduced clock speeds and reduced voltage.

Gulftown

On 11 March 2010, the first i7 processors appeared with Gulftown architecture. The first model was the i7- 980X Extreme Edition with a clock speed of 3.33 GHz. For processors with Gulftown architecture is the first native six-core processor ( Hexa -core ) by Intel. Since this is manufactured in 32- nm manufacturing process, Intel assigns him, just like the Clarkdale, the Westmere generation. The Gulftown is in terms of performance above the Bloomfield, is made for the socket 1366 and can be operated with the X58 chipset. Gulftown supports Hyper -Threading and also brings special functions for accelerated encryption in the form of the AES New Instructions (AES- NI) with.

Cores of Sandy Bridge generation

Sandy Bridge

Sandy Bridge processors are available in both quad-core version as well as in the dual-core version with integrated GPU. From the dual-core version there are two versions, one with the larger GPU with 12 shader units and another with a smaller GPU with Shader only 6 units. In this generation, there are models for the desktop area, which take place on the socket 1155, and models for mobile applications that rely on the PGA 988B Socket (G2 ), BGA BGA 1023 and 1224.

Chipset for Sandy Bridge processors

To operate the Sandy Bridge processors, a Cougar Point chipset of Intel 6- series is necessary. End of January 2011 a hardware bug was discovered in this present in the B2 stepping chipset, Intel led to a halt in production and initially to a recall of pages. The production of the chipset was changed at the same time on an adjusted by the error B3 stepping version. Later, Intel decided that the B2 stepping chipsets to OEMs to sell, since only the four SATA-3-Gb/s-Ports are affected by the problem and use the two remaining SATA-6-Gb/s-Ports no problems arise. Such motherboards could then be used in notebooks and complete systems in which only two drives are installed in the system. Moreover, additional SATA-6-Gb/s-Ports can still be realized by adding chips.

Sandy Bridge E

The six-core models sold in the desktop segment are actually native eight -core with two cores disabled. An integrated graphics processor processors do not have this, but, the integrated PCIe controller more than twice as many lanes on than the Sandy Bridge (without E) is the case. The Patsburg chipset X79 is still connected using DMI with 20 Gbit / s. Due to the extra PCIe lanes, the quad -channel memory controller, and the descent of the CPU of the server segment, where even QPI interfaces (which are switched off when Desktoppendant ) are available to connect further CPUs Sockelpinanzahl grows to 2011 pins of.

In February 2012, Intel also introduced a quad-core offshoot for Socket 2011. The processor design is identical to the reduced L3 cache and fewer cores and thus fewer transistors and smaller chip area, the eight-core version. However, the quad-core version offers no open multiplier.

Cores of the Ivy Bridge generation

Ivy Bridge processors are available in both quad-core version as well as the dual-core versions. As with the Sandy Bridge there will be versions with full expansion stage of the GPU with 16 shader units, but also with only 6 shader units.

Chipset for Ivy Bridge processors

Ivy Bridge processors are compatible with the chipsets for the Sandy Bridge processors. In addition, Intel leads with new Ivy Bridge chipsets with additional equipment features such as USB 3.0 ports, a. On many motherboards, originally developed for Sandy Bridge chipsets Ivy Bridge generation could be built based on the same shelf for a BIOS update processors. For the use of PCI - Express 3.0, a processor of Ivy Bridge series is necessary because only Ivy Bridge processors have the necessary controller.

Processor cores of the Haswell generation

Haswell processors are available in both quad-core version as well as the dual-core versions. All models currently available include an integrated GPU. In contrast to the previous generation Haswell processors rely on the newly developed LGA1150 socket, it will not be compatible with the motherboard of the previous series.

Chipset for Haswell processors

Haswell processors are not compatible with the chipsets for Ivy Bridge processors. In addition, Intel leads with Haswell new chipsets with additional equipment features, such as more USB 3.0 ports, a.

Models

Desktop

Clarkdale

Dual-core processor ( dual-core )

  • L1 - Cache: 32 32 KiB per core (data instructions )
  • L2 cache: 256 KiB per core processor with clock
  • L3 - cache: 4096 KiB with QPI clock
  • MMX, SSE, SSE2, SSE3, SSSE3, SSE4.2, Intel 64, EIST, XD-Bit, IVT, SMT. Only with Core i5 models released: AES instructions, TXT. Exception: Core i5 -661 without TXT and Intel VT- d!
  • Tailed on QPI dual-channel DDR3 memory controller, PCIe 2.0 controller and GPU
  • Socket 1156, Direct Media Interface (DMI ) and Flexible Display Interface (FDI )
  • Operation voltage ( Vcore ): 0.65 to 1.4 V
  • Power loss (TDP ): 73-87 W
  • Release Date: January 4, 2010
  • Manufacturing Technology: 32 nm (45 nm in the GPU core with memory controller and PCIe controller )
  • The size: 81 mm ² at 383 million transistors and 114 mm ² with 177 million transistors for the GPU core
  • Clock rates: 2.8-3.6 GHz
  • Models: Intel Core i3- 530 and Intel Core i5 -680

Lynnfield

Quad-core processor ( quad-core )

  • L1 - Cache: 32 32 KiB per core (data instructions )
  • L2 cache: 256 KiB per core processor with clock
  • L3 - cache: 8192 KiB with QPI clock
  • Integrated dual-channel DDR3 memory controller; on internal QPI with 2.13 to 2.4 GHz ( 17.07 to 19.2 GB / s) tailed PCIe 2.0 controller with 16 lanes
  • Operation voltage ( Vcore ): 0.65 to 1.4 V
  • Power loss (TDP ): 82-95 W
  • Release Date: September 8, 2009
  • Manufacturing Technology: 45 nm
  • The size: 296 mm ² with 774 million transistors
  • Clock rates: 2.66 to 3.06 GHz
  • Models: Intel Core i5- 750 and Intel Core i7 -880

Bloomfield

Quad-core processor ( quad-core )

  • L1 - Cache: 32 32 KiB per core (data instructions )
  • L2 cache: 256 KiB per core processor with clock
  • L3 - cache: 8192 KiB with QPI clock
  • Integrated triple-channel DDR3 memory controller: support up to DDR3 -1066
  • Socket 1366, QuickPath Interconnect with 2.4 to 3.2 GHz ( from 9.6 to 12.8 GB / s in each direction, or from 19.2 to 25.6 GB / s total )
  • Operation voltage ( Vcore ): 0.8 to 1.375 V
  • Power loss (TDP ): 130 W
  • Release Date: November 18, 2008
  • Manufacturing Technology: 45 nm
  • The size: 263 mm ² with 731 million transistors
  • Clock rates: 2.66 to 3.33 GHz
  • Models: Intel Core i7- 920 to Intel Core i7 -975 Extreme Edition

Gulftown

Six Core Processor ( Hexa -core )

  • L1 - Cache: 32 32 KiB per core (data instructions )
  • L2 cache: 256 KiB per core processor with clock
  • L3 cache: 12 MiB
  • Integrated triple-channel DDR3 memory controller: support up to DDR3 -1066
  • Socket 1366, QuickPath Interconnect at 3.2 GHz ( 12.8 GB / s in each direction, and 25.6 GB / s total )
  • Operation voltage ( Vcore ): 0.8 to 1.375 V
  • Power loss (TDP ): 130 W
  • Release Date: March 16, 2010
  • Manufacturing Technology: 32 nm
  • The size: 248 mm ² at 1.17 billion transistors
  • Clock rates: 3.20 to 3.46 GHz
  • Models: Intel Core i7 -970 up to Intel Core i7- 990X Extreme Edition

Sandy Bridge Duo

Dual-core processor ( dual-core )

  • L1 - Cache: 32 32 KiB per core (data instructions )
  • L2 cache: 256 KiB per core processor with clock
  • L3 cache: 3 MiB with processor clock
  • MMX, SSE, SSE2, SSE3, SSSE3, SSE4.2, Intel 64, EIST, XD-Bit, IVT, AVX, SMT. Core i5 CPUs have additional AES instructions, TXT and VT -d enabled.
  • Integrated dual-channel DDR3 memory controller and PCIe 2.0 controller with 16 lanes
  • Integrated GPU
  • Socket 1155, DMI 5 GT / s (full duplex, max. 20Gbit / s per direction) and FDI
  • Power loss (TDP ): 35-65 W
  • Release Date: February 20, 2011
  • Manufacturing Technology: 32 nm
  • The size: 131 mm ² at 504 million transistors including HD 2000 GPU and integr. Northbridge, 149 mm ² at 624 million transistors including HD 3000 GPU core and integr. Northbridge
  • Clock rates: 2.5-3.3 GHz
  • Models: Intel Core i3- 2100 to the Intel Core i5- 2390T

Sandy Bridge

Quad-core processor ( quad-core )

  • L1 - Cache: 32 32 KiB per core (data instructions )
  • L2 cache: 256 KiB per core processor with clock
  • L3 cache: 6 to 8 MiB with processor clock
  • MMX, SSE, SSE2, SSE3, SSSE3, SSE4.2, Intel 64, EIST, XD-Bit, IVT, AES instructions, AVX, TXT. Exception: All processors with a K behind the model number and the Core i5 2300 without TXT and Intel VT -d. In addition, only the Core i7 CPUs have SMT enabled.
  • Integrated dual-channel DDR3 memory controller and PCIe 2.0 controller with 16 lanes
  • Integrated GPU (on some models disabled)
  • Socket 1155, DMI 5 GT / s (full duplex, max. 20Gbit / s per direction) and FDI
  • Operation voltage ( Vcore ): NA
  • Power loss (TDP ): 45-95 W
  • Release Date: January 9, 2011
  • Manufacturing Technology: 32 nm
  • The size: 216 mm ² at 1.16 billion transistors (. Including GPU core and integr Northbridge )
  • Clock rates: 2.3-3.5 GHz
  • Models: Intel Core i5- 2300 and Intel Core i7- 2700K

Sandy Bridge E

Six Core Processor ( Hexa -core )

  • L1 - Cache: 32 32 KiB per core (data instructions )
  • L2 cache: 256 KiB per core processor with clock
  • L3 cache: 12 to 15 MiB with processor clock
  • Integrated quad-channel DDR3 memory controller and PCIe 3.0 controller with 40 lanes ( officially is only PCIe 2.0 support )
  • Socket 2011 DMI 5 GT / s (full duplex, max. 20Gbit / s per direction )
  • Operation voltage ( Vcore ): 0.6 to 1.35 V
  • Power loss (TDP ): 130 W
  • Release Date: November 14, 2011
  • Manufacturing Technology: 32 nm
  • The size: 435 mm ² at 2.27 billion transistors (including the disabled cores)
  • Clock rates: 3.2-3.5 GHz
  • Models: Intel Core i7- 3930K to Intel Core i7- 3970X

Sandy Bridge E ( Quad)

Quad-core processor ( quad-core )

  • L1 - Cache: 32 32 KiB per core (data instructions )
  • L2 cache: 256 KiB per core processor with clock
  • L3 cache: 10 MiB with processor clock
  • Integrated quad-channel DDR3 memory controller and PCIe 3.0 controller with 40 lanes ( officially is only PCIe 2.0 support )
  • Socket 2011 DMI 5 GT / s (full duplex, max. 20Gbit / s per direction )
  • Operation voltage ( Vcore ): 0.6 to 1.35 V
  • Power loss (TDP ): 130 W
  • Release Date: February 14, 2012
  • Manufacturing Technology: 32 nm
  • The size: 294 mm ² at 1.27 billion transistors
  • Clock speed: 3.6 GHz
  • Models: Intel Core i7- 3820

Ivy Bridge

Quad-core processor ( quad-core )

  • L1 - Cache: 32 32 KiB per core (data instructions )
  • L2 cache: 256 KiB per core processor with clock
  • L3 cache: 6 to 8 MiB with processor clock
  • MMX, SSE, SSE2, SSE3, SSSE3, SSE4.2, Intel 64, EIST, XD-Bit, IVT, AES instructions, AVX, TXT. Exception: All processors with a K behind the model number and the Core i5 -3450 without TXT and Intel VT -d. In addition, only the Core i7 CPUs have SMT enabled.
  • Integrated dual-channel DDR3 memory controller and PCIe 3.0 controller with 16 lanes
  • Integrated GPU
  • Socket 1155, DMI 5 GT / s (full duplex, max. 20Gbit / s per direction) and FDI
  • Power loss (TDP ): 45-77 W
  • Release Date: April 23, 2012
  • Manufacturing Technology: 22 nm
  • The size: 160 mm ² at 1.4 billion transistors (including iGPU and integr Northbridge. )
  • Clock rates: 2.5-3.5 GHz
  • Models: Intel Core i5- 3330 to the Intel Core i7- 3770K

Ivy Bridge Duo

Dual-core processor ( dual-core )

  • L1 - Cache: 32 32 KiB per core (data instructions )
  • L2 cache: 256 KiB per core processor with clock
  • L3 cache: 3 MiB with processor clock
  • Integrated dual-channel DDR3 memory controller and PCIe 3.0 controller with 16 lanes ( officially is only PCIe 2.0 support )
  • Integrated GPU
  • Socket 1155, DMI 5 GT / s (full duplex, max. 20Gbit / s per direction) and FDI
  • Power loss (TDP ): 35 - 55 W
  • Release Date: September 2, 2012
  • Manufacturing Technology: 22 nm
  • The size: 94 mm ² (. Including iGPU and integr Northbridge )
  • Clock rates: 2.8 to 3.4 GHz
  • Models: Intel Core i3- 3220T and Intel Core i3 -3240

Haswell

Quad-core processor ( quad-core )

  • L1 - Cache: 32 32 KiB per core (data instructions )
  • L2 cache: 256 KiB per core processor with clock
  • L3 cache: 2 MiB to 8 MiB
  • Integrated GPU
  • Socket 1150
  • Power loss (TDP ): 35-84 W
  • Release Date: June 4, 2013
  • Manufacturing Technology: 22 nm
  • Clock rates: 2.3 to 3.9 GHz
  • Models: Intel Core i7- 4770 series

Mobile

Clark Field

Quad-core processor ( quad-core )

  • L1 - Cache: 32 32 KiB per core (data instructions )
  • L2 cache: 256 KiB per core processor with clock
  • L3 cache: 6144-8192 KiB, some models part - disabled
  • Integrated dual-channel DDR3 memory controller; tailed on internal QPI PCIe 2.0 controller
  • Socket PGA988, DMI 2.5 GT / s (full duplex, max. 10Gbit / s per direction, a total of 2 GB / s)
  • Operation voltage ( Vcore ): 0.65 to 1.4 V
  • Power loss (TDP ): 45-55 W
  • Release Date: September 23, 2009
  • Manufacturing Technology: 45 nm
  • The size: 296 mm ² with 774 million transistors
  • Clock rates: 1.6 to 2.13 GHz
  • Models: Intel Core i7- 720QM to i7 - 940XM Extreme Edition

Arrandale

Dual-core processor ( dual-core )

  • L1 - Cache: 32 32 KiB per core (data instructions )
  • L2 cache: 256 KiB per core processor with clock
  • L3 - cache: 4096 KiB (some models do not fully unlocked )
  • Tailed on QPI dual-channel DDR3 memory controller, PCIe 2.0 controller and GPU
  • Socket PGA988, Direct Media Interface (DMI ) and Flexible Display Interface (FDI )
  • Base BGA1288, Direct Media Interface (DMI ) and Flexible Display Interface (FDI )
  • Operation voltage ( Vcore ): NA
  • Power loss (TDP ): 18-37 W
  • Release Date: January 4, 2010
  • Manufacturing Technology: 32 nm (45 nm in the GPU core with memory controller and PCIe controller )
  • The size of 81 mm ² at 383 million transistors for the CPU, and in addition 114 mm ² at 177 million transistors for the uncore area
  • Clock rates: 1.06 to 2.80 GHz
  • Models: Intel Core i3- 330M up to Intel Core i7- 640M

Sandy Bridge

Quad-core processor ( quad-core )

  • L1 - Cache: 32 32 KiB per core (data instructions )
  • L2 cache: 256 KiB per core processor with clock
  • L3 cache: 6 to 8 MiB with processor clock
  • MMX, SSE, SSE2, SSE3, SSSE3, SSE4.2, Intel 64, EIST, XD-Bit, IVT, AES instructions, AVX, SMT, TXT. Exception: Core i7- 263XQM without TXT, Intel VT -d and AES instructions.
  • Integrated dual-channel DDR3 memory controller and PCIe 2.0 controller with 16 lanes
  • Integrated GPU
  • Socket PGA988 (G2) and socket BGA1224, DMI 5 GT / s (full duplex, max. 20Gbit / s per direction) and FDI
  • Operation voltage ( Vcore ):
  • Power loss (TDP ): 45-55 W
  • Release Date: January 2011
  • Manufacturing Technology: 32 nm
  • The size: 216 mm ² at 1.16 billion transistors (. Including GPU core and integr Northbridge )
  • Clock rates: 2.0 to 2.7 GHz
  • Models: Intel Core i7- 2630QM to i7 - 2960XM Extreme Edition

Sandy Bridge Duo

Dual-core processor ( dual-core )

  • L1 - Cache: 32 32 KiB per core (data instructions )
  • L2 cache: 256 KiB per core processor with clock
  • L3 cache: 3 to 4 MiB MiB with processor clock
  • MMX, SSE, SSE2, SSE3, SSSE3, SSE4.2, Intel 64, EIST, XD-Bit, IVT, AVX, SMT. From Core i5- 2500 series also AES instructions, TXT and VT -d enabled.
  • Integrated dual-channel DDR3 memory controller and PCIe 2.0 controller with 16 lanes
  • Integrated GPU
  • Socket PGA988 (G2) and socket BGA1023, DMI 5 GT / s (full duplex, max. 20Gbit / s per direction) and FDI
  • Operation voltage ( Vcore ):
  • Power loss (TDP ): 17-35 W
  • Release Date: March 2011
  • Manufacturing Technology: 32 nm
  • The size: 149 mm ² at 624 million transistors (. Including GPU core and integr Northbridge )
  • Clock rates: 1.4 to 2.8 GHz
  • Models: Intel Core i3- 2310M up to Intel Core i7- 2677M

Ivy Bridge

Quad-core processor ( quad-core )

  • L1 - Cache: 32 32 KiB per core (data instructions )
  • L2 cache: 256 KiB per core processor with clock
  • L3 cache: 6 to 8 MiB with processor clock
  • Integrated dual-channel DDR3 memory controller and PCIe 3.0 controller with 16 lanes
  • Integrated GPU
  • Socket PGA988 (G2) and socket BGA1224, DMI 5 GT / s (full duplex, max. 20Gbit / s per direction) and FDI
  • Power loss (TDP ): 35-55 W
  • Release Date: April 29, 2012
  • Manufacturing Technology: 22 nm
  • The size: 160 mm ² at 1.4 billion transistors (including iGPU and integr Northbridge. )
  • Clock rates: 2.1 to 3.0 GHz
  • Models: Intel Core i7- 3610QM up to Intel Core i7- 3940XM

Ivy Bridge Duo

Dual-core processor ( dual-core )

  • L1 - Cache: 32 32 KiB per core (data instructions )
  • L2 cache: 256 KiB per core processor with clock
  • L3 cache: 3 to 4 MiB MiB with processor clock
  • MMX, SSE, SSE2, SSE3, SSSE3, SSE4.2, Intel 64, EIST, XD-Bit, IVT, AES instructions, AVX, SMT, TXT. For models below the Core i5- 3320M and Core i7- 3517U TXT is disabled.
  • Limited integrated dual-channel DDR3 memory controller and PCIe 3.0 controller with 16 lanes, for CPUs with 17W TDP on PCIe 2.0
  • Integrated GPU
  • Socket PGA988 (G2) and socket BGA1023, DMI 5 GT / s (full duplex, max. 20Gbit / s per direction) and FDI
  • Power loss (TDP ): 17-35 W
  • Release Date 31 May 2012
  • Manufacturing Technology: 22 nm
  • The size: 118 mm ² (. Including iGPU and integr Northbridge )
  • Clock rates: 1.7 to 2.9 GHz
  • Models: Intel Core i3- 3110M up to Intel Core i7- 3667U

Product logos

Logo of the Core i3 Sandy Bridge - based

Logo of the Core i5 on Sandy Bridge - based

Logo of the Core i7 on Sandy Bridge - based

Logo of the Core i3 based on Haswell

Logo of the Core i5 on Haswell - based

Logo of the Core i7 on Haswell - based

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